Labs

Labs

Woltosz Engineering Research Laboratory: General pic (need pic) of lab space on top, then this statement below the pic: Our laboratory space in the Woltosz Engineering Research Laboratory is primarily used for performing research and development activities. It includes class 10, 100 and 1,000 areas in a Bay & Chase configuration with 4 to 6 inch (100 to 150 mm) wafer processing tools for: Lithography, Deposition/Thermal/Etching and Wet Processing. Equipment details can be found here.

Broun Hall: General pic (need pic) of lab space on top, then this statement below the pic: Our laboratory in Broun Hall is used as our teaching space, as well as for research activities. It includes class 100 and 1000 areas with photolithography and wet processing, as well as flexible space for use in developing new fabrication equipment and processes. Equipment details can be found here.

Packaging: General pic (need pic) of SMT packaging line, then this statement below the pic: Our Packaging lab, also in Broun Hall, includes a surface mount technology line and thick-film processing tools, as well as flip-chip and wirebonding capabilities. This lab also hosts numerous characterization and analysis capabilities including ovens that cover a wide temperature range, environmental test chambers, electrical and mechanical characterization, and cross-section generation and microscopy/imaging capabilities. Equipment details can be found here.

Cryo and microwave: General pic (need pic) of cryo/microwave, then this statement below the pic: Our cryo + microwave lab, located in Broun Hall, includes a substantial set of tools for performing characterization activities and research over a wide range of temperatures (down to 1.2 K) and over a wide range of frequencies (DC to 110 GHz). This lab provides an array of cooling capabilities including dunking into cryogenic liquids (LN2 and LHe) as well as multiple closed-cycle cryogenic systems. Our advanced research systems cryogenic probe station provides chip/component level probing at temperatures down to ~ 15 K. RF and microwave capabilities include both time and frequency domain tools for signal and power integrity characterization of high-speed and dense electronics systems. Equipment details can be found here.

Laser: General pic (need pic) of laser lab and Masoud’s input, then this statement below the pic: Our laser lab, located in Broun Hall, is currently under development and will be online very soon. This lab will host unique laser-assisted deposition and fabrication capabilities. Equipment details can be found here.