Equipment

(click on the equipment name for description, location, additional information and links to SOPs)

• Deposition and thermal:
  • CHA Mark 50 Electron Beam / Sputter Deposition with Ion Clean
  • Diffusion / Oxidation Furnace
  • YES Curing Oven
  • Ultratech PEALD
  • AU Thermal ALD
  • Dimatix DMP-2831 Materials Printer
  • Gold Sputter Coater (for SEM)
  • Carbon Coater (for SEM)
• Lithography:
  • Raith eLine Electron Beam Lithography
  • OAI Mask Aligner
  • SUSS MA6/BA6 Mask Aligners
• Etching / Cleaning:
  • STS ASE – Advanced Silicon Etcher
  • STS AOE – Advanced Oxide Etcher
  • Technics PE-IIA – Plasma System
  • Branson Plasma Barrel Asher
  • YES-R3 – Plasma System
• Packaging:
  • Solder Deposition: MPM
  • Pick-and-Place: GSM Genesis
  • Solder Reflow: Heller 1800 EXL
  • Thick-Film: MPM TF-100
  • Flip-chip: Suss FC-150 and SEC 4150
  • Vacuum Packaging: SST 3150
  • Wirebonders:
  • Other:
• Characterization/ Failure/Reliability:
  • Gatan Cross-Section
  • Dage PC2400
  • Dage Die Shear and Bond Pull
  • Probe Stations: Micromanipulator Co., Signatone S-170, ARS Cryogenic and Signatone S-1045 (high-temperature)
  • Other: Ovens, DRS 24 package re-work station, Buehler sample preparation, Misonix Sonicator XL