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Description: YES-PB Series manual load high temperature cure oven is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-PB Series helps achieve total environmental control to increase yields and extend device performance.

Location: WERL Cleanroom

Link to manufacturer information: YES PB Series

Link to SOP: YES Curing Oven SOP

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